Version 0.2.0

First release prepared for manufacturing at the factory.

Modifications:

• power and reset switches are now SMD and moved near Ethernet for
  cluster deployments
• power and activity LEDs moved near Ethernet (see above)
• buffer chip swapped due to chip shortage and package changed
• rpiboot jumper replaced with unpopulated header for those willing to
  use it often

Fixes:

• rerouted most of the traces for 6mil width and spacing (makes
  production way cheaper in most factories)

Version 0.1.1

Second release for manufacturing in JLCPCB.

Adds

• BOM entries for SMT ICs

Fixes

• increase width of power rail
• move TP5
• do not tent vias
• increase width of Ethernet shield mounting hole
• minor reconfigurations to KiCAD project
• all externals are now git submodules

Version 0.1.0

First version sent to factory for manufacturing.

Known issues:

• no drills on vias going to USB testpoints (#1).
• too thin +5V power rail (#2).