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Updated DNX chip bcmsai version 7.1.66.7 #18671

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merged 1 commit into from
Apr 14, 2024

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vmittal-msft
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Why I did it

Add following fixes to the SAI

  1. BRCM CSP # CS00012343052 - ESB_ECC_Ecc_2bErrInt seen in production
  2. BRCM CSP # CS00012333604 - J2C+ internal thermal sensor(s) spiking high spontaneously, seemingly in error
Work item tracking
  • Microsoft ADO (27643432):

How I did it

How to verify it

Which release branch to backport (provide reason below if selected)

  • 201811
  • 201911
  • 202006
  • 202012
  • 202106
  • 202111
  • 202205
  • 202211
  • 202305

Tested branch (Please provide the tested image version)

Description for the changelog

Link to config_db schema for YANG module changes

A picture of a cute animal (not mandatory but encouraged)

@vmittal-msft vmittal-msft self-assigned this Apr 12, 2024
@vmittal-msft vmittal-msft added the Chassis 🤖 Modular chassis support label Apr 12, 2024
@rlhui rlhui merged commit bdc1675 into sonic-net:202205 Apr 14, 2024
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Chassis 🤖 Modular chassis support
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2 participants