First release.
PCB to be produced with 0.8mm thickness, 3313 stack-up, ENIG, V-CUT, and chamfered edges on the M.2 connector side. Castellated holes are not required as the hole has no electrical functions.
Note that poor soldering of USBLC6-2P6 may lead to USB communication failure.
If a stencil is used, be careful of the amount of solder paste applied. It is easy to apply too much solder and bridge the pins of the RAK3172 LGA package.
A hot air station or mini reflow oven must be used, as a soldering iron simply cannot solder LGA package.